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| Categories | Thermal Conductive Gel |
|---|---|
| Brand Name: | Ziitek |
| Model Number: | TIF090-11 |
| Certification: | RoHS |
| Place of Origin: | Vietnam |
| MOQ: | 1000tube |
| Price: | 0.1-10 USD/PCS |
| Payment Terms: | T/T |
| Supply Ability: | 1000000 tube/month |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 300cc/tube |
| Products name: | TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink |
| Materail: | Ceramic Filled Silicon Material |
| Color: | Gray |
| Application: | Electronic Component Gap Filling |
| Specific Gravity: | 3.45g/cc |
| Thermal conductivity: | 9.0W/mK |
| Continuous Use Temperature: | -45~200℃ |
| Keywords: | Thermal conductive gel |
| Company Info. |
| CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM |
| Verified Supplier |
| View Contact Details |
| Product List |
TIF090-11 High Thermal Conductive 9.0W Thermal Condauctive Gel For Heat Sink
TIF®090-11 is a soft silicone-based gap filler pad formulated with thermally conductive fillers and a unique compound that combines excellent themal performance with outstanding softness. Compared to conventional thermal grease,TIF®090-11 has a higher viscosity, effectively preventing the separation of fllers from the siliconebase. lt also offers more stable bond line control under pressure,enhancing product reliability. TIF®090-11 is applied similaty to traditional themal paste and is compatible with various commercial equipment,such as dispensing systems or automated production equipment. lt is suitable for a wide range of high-power electronic components and packaging formats, including flip-chip microprocessors (Flip-Chip MPU),PPGA, micro BGA,BGA,DSP chips, circular accelerator chips, and LED lighting modules.
Feature
> Thermal conductivity: 9.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry
> Semiconductor automatic laboratory equipment
| TIFTM090-11 Typical Property | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Viscosity | 13000K mPa.s | GB/T 10247 |
| Specific Gravity | 3.45g/cm³ | ASTM D297 |
| Thermal conductivity | 9.0 W/mK | ASTM D5470 |
| Thermal resistance @10Psi(℃-in²/W) | 0.089 | ASTM D5470 |
| Thermal resistance @50Psi(℃-in²/W) | 0.055 | ASTM D5470 |
| Recommended Operating temp | -45~200℃ | ***** |
| Dielectric breakdown strength(V/mm) | ≥4000 | ASTM D149 |
| Bond line Thickness | 0.4 | ****** |
| D3-D10(Siloxane Content, ppm) | ＜100 | GC-MS |
| Flame Rating | V-0 | UL 94 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Q&A
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
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