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Single Layer Fr4 PCB With High Resistance Carbon Ink HDI Circuit Boards

Categories HDI PCB Board
Brand Name: Found
Model Number: fd46
Certification: UL E361831 ISO9001 TS16949
Place of Origin: China
MOQ: 1PC
Price: Negotiatable
Payment Terms: T/T
Supply Ability: 100000PC
Delivery Time: 2-8 days
Packaging Details: Vacuum packing
Copper thickness: 1oz
Base material: FR-4
Min. line spacing: 0.003"
Board thickness: 1.6mm
Min. line width: 0.1mm
Min. hole size: 0.1mm
Surface finishing: HASL
Number of layers: 4-Layer
Solder mask: Green
Application: Electronics Device
Solder mask color: Green
Product name: Printed Circuit Board
Silkscreen color: White
Service: OEM one-stop service
Testing service: 100% Electrical Test
Material: FR4/94v0/Aluminum/cem-1 cem-3/
Other service: PCB Design
Pcb test: Flying probe and AOI (Default)/Fixture Test
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    • Product Details
    • Company Profile

    Single Layer Fr4 PCB With High Resistance Carbon Ink HDI Circuit Boards

    Single Layer Fr4 PCB With High Resistance Carbon Ink HDI Circuit Boards​

    • Product Details

    Model NO.: WBPN2256BO
    Processing Technology: Electrolytic Foil
    Base Material: Copper
    Insulation Materials: Epoxy Resin
    Brand: Xzg
    Size: 268mm*78.6mm
    Min. Hole Size: 0.7mm
    Min Line Width and Distance: 7/7mil
    Solder Mask: Green
    Silkscreen: White
    Trademark: XZG
    Transport Package: Vaccume Package
    Specification: UL/GSG/RoHS
    Origin: China

    Hot Tags: single layer fr4 pcb with high resistance carbon ink, China, factory, manufacturers, suppliers, quotation, made in China


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    Product Description:

    1Layer Count1-30Layers
    2HDI Type1+N+1, 2+N+2
    3MaterialCEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc
    4Board thickness0.2~5.0mm
    5Board SizeMax600*1000mm (24"x40")
    Min30x50mm
    6Copper ThicknessOuter layer1oz~6oz
    Inner layerHoz~5oz
    7Min. Line Width/Space4/4mil(0.1/0.1mm)
    8Finished Hole sizeMechanical0.20~6.30mm
    Laser5mil, 6mil
    9Blind/buried via(Mechanical)0.2mm (min)
    10Aspect Ratio10:1
    11Hole Dia.TolerancePTH±0.075mm(3mil)
    NPTH±0.05mm (2mil)
    12Hole Position Tolerance±0.05mm (2mil)
    13Bow & Twist≤0.75%
    14Peel strength1.4N/mm
    15Thermal stress288 degrees centigrade & 20 Sec
    16Test Voltage50-300V
    17Soldermask colorGreen, Red, B




    PCB TypeSingle-side pcb , Double side pcb , Multilayer pcb , Aluminum base PCB
    HDI board pcb , High Tg pcb and so on
    Base MaterialXPC ,CEM-1 , CEM-3 , FR-1 , FR4 ,High TG FR4 ,Aluminium , Lead Free Materials (Rohs compliant ),High Frenquency Material and so on
    Layer No .1-18 Layers
    Surface FinishHASL , HASL Lead Free , Immersion Gold ,Gold Plating , Gold Finger , Immersion Silver , Immersion Tin , OSP ,Peelable soldermask and carbon ink
    Silk ScreeningIn any color such as green ,white ,nlue ,red , black and so on
    CertificateISO9001,ISO14001,ISO-TS, UL,ROHS
    TestingElectrical Testing , Controlled Impedance Testing , Flying Probe Test , X-Ray Inspection AOI Test
    EnvironmentClean room environmen , Dust-free workshop
    TransportationFedex ,DHL,UPS and so on
    FilesGerber ,Protel ,Autocad ,Powerpcb , Orcad ,etc


    PRODUCTION CAPACITY

    ItemsParameterSpecial
    Layers Counts2-20
    Board materialFR-4,AluminumHigh Tg FR4
    max Fabrication area580×700mm500mm×3000mm
    Board thickness0.1-3.2mm
    CamberDouble Side
    multi -layers
    d ≤0.075mm
    d ≤1%
    d≤0.05mm
    Impedance±7%±5%
    PTH toleranced>5.0±0.076mm
    0.3<d≤5.0±0.05mm
    d≤0.3±0.08mm
    Min finished hole size0.15mm
    Hole copper thickness≥20um
    Min track width, spacing0.05mm ×0.05mm
    Profile size±0.1mm±0.05mm
    ProfileRouting,Punch,Cut,V-cut,Chanfer
    Surface finishImmersion Gold:0.025~0.075um
    Gold finger:≥0.13 um≥1.0 um
    OSP:0.2-0.5µm
    HAL:5~20 um
    LEADFREE HAL:5~20 um
    Surface platingSolder mask: Black Green White Red Thickness≥17 um,Block,BGA
    Character : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mm
    Ppeelable mask: red bule thickness≥300 um
    Carbonink : Black thickness≥25 um Highness≥0.30mm Width≥0.3mm
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