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FR4 Material HDI PCB Board , High Precision Circuit Board For Electronic Products

Categories HDI PCB Board
Brand Name: YScircuit
Model Number: YS-HDI-0004
Certification: ISO9001,UL,REACH, RoHS
Place of Origin: Shenzhen
MOQ: 1 piece
Price: 0.04-5$/piece
Payment Terms: T/T,PayPal, Alibaba pay
Supply Ability: 251,000 square meter/year
Delivery Time: 2-8 days
Packaging Details: Foam cotton + carton + strap
Material: FR4
Size: According To Customer Request
Process: Immersion Gold/sliver
Surface Finishing: HASL/HASL-LF/ENIG/OSP
Copper thickness: 0.25OZ~12OZ
Base material: FR-4
Min. line spacing: 3mil
Board thickness: 0.2-6.0mm
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    FR4 Material HDI PCB Board , High Precision Circuit Board For Electronic Products

    Shenzhen Electronic Products PCBA Board High Precision Circuit Board HDI PCB

    What is HDI PCB

    Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.

    HDI PCBs take advantage of the most recent technologies existing to amplify the functionality of circuit boards by means of the similar or little amounts of area. This development in board technology is motivated by the tininess of parts and semiconductor packages that assist superior characteristics in innovative new products like touch screen tabs.


    HDI PCB:

    High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

    HDI PCB 2+n+2

    Parameters

    • Layers: 12
    • Base Material:FR4 High Tg EM827
    • Thickness:1.2±0.1mm
    • Min.Hole Size:0.15mm
    • Minimum Line Width/Space:0.075mm/0.075mm
    • Minimum Clearance between Inner Layer PTH and Line: 0.2mm
    • Size:101mm×55mm
    • Aspect Ratio:8 : 1
    • Surface treatment:ENIG
    • Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole
    • Applications:Telecommunication

    YScircuit HDI PCB manufacturing capabilities overview
    Featurecapabilities
    Layer Count4-60L
    Available HDI PCB Technology1+N+1
    2+N+2
    3+N+3
    4+N+4
    5+N+5
    Any layer
    Thickness0.3mm-6mm
    Minimum line Width and Space0.05mm/0.05mm(2mil/2mil)
    BGA PITCH0.35mm
    Min laser Drilled Size0.075mm(3nil)
    Min mechanical Drilled Size0.15mm(6mil)
    Aspect Ratio for laser hole0.9:1
    Aspect Ratio for through hole16:1
    Surface FinishHASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
    Via Fill OptionThe via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
    Copper filled, silver filled
    Laser via copper plated shut
    Registration±4mil
    Solder MaskGreen, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

    YScircuit Bare Boards Normally Delivery Time
    layer/m²S<1㎡S<3㎡S<6㎡S<10㎡S<13㎡S<16㎡S<20㎡S<30㎡S<40㎡S<50㎡S<65㎡S<85㎡S<100㎡
    1L4wds6wds7wds7wds9wds9wds10wds10wds10wds12wds14wds15wds16wds
    2L4wds6wds9wds9wds11wds12wds13wds13wds15wds15wds15wds15wds18wds
    4L6wds8wds12wds12wds14wds14wds14wds14wds15wds20wds25wds25wds28wds
    6L7wds9wds13wds13wds17wds18wds20wds22wds24wds25wds26wds28wds30wds
    8L9wds12wds15wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
    10L10wds13wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
    12L10wds15wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
    14L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds30wds
    16L10wds16wds17wds18wds20wds20wds22wds24wds26wds27wds28wds30wds

    30wds


    FQA


    What is HDI PCBs?


    High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market.

    Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities.

    A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.


    1.Multi-step HDI enables the connection between any layers;

    2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

    3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.


    Quality FR4 Material HDI PCB Board , High Precision Circuit Board For Electronic Products for sale
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