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4 layer Prototype PCB Assembly Android robot PCBA HASL Surface Finish

Categories Prototype PCB Assembly
Brand Name: YINGSTAR
Model Number: Yst-Ds1
Certification: UL/ROHS/CE
Place of Origin: China
Price: Negotiation
Payment Terms: T/T, Western Union
Supply Ability: 100,000pcs per month
Delivery Time: 15-20working days
Packaging Details: Anti-static bag + Anti-static bubble wrap + Carton box
Material: FR4
Solder mask: Green
Copper weight: 1OZ
Surface finish: HASL
impedance control: No
Functional test: Yes
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    4 layer Prototype PCB Assembly Android robot PCBA HASL Surface Finish

    4 layer green solder mask Android robot PCBA Prototype PCB Assembly

    The layer count of the PCB Circuit Board is 2 Layers, and it was made with FR4 PCB board material, with 1 Oz / 35 µm copper thickness. Also, the board size of this FR4 PCB Board is 178.5 * 99 mm, with green solder mask and OSP surface treatment.

    1. Technical requirements for pcb&pcb assembly:

    • Professional Surface-mounting and Through-hole soldering Technology
    • Various sizes like 1206,0805,0603,0402,0201 components SMT technology
    • ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
    • PCB Assembly With UL,CE,Rohs Approval
    • Nitrogen gas reflow soldering technology for SMT.
    • High Standard SMT&Solder Assembly Line
    • High density interconnected board placement technology capacity.

    2. Our PCBA Capabilities

    Type of AssemblySMT,Thru-hole
    Solder TypeWater Soluble Solder Paste,Leaded and Lead-Free
    ComponentsPassive Down to 0201 size
    BGA and VFBGA
    Leadless Chip Carriers/CSP
    Double-sided SMT Assembly
    Fine Pitch to 0.8mils
    BGA Repair and Reball
    Part Removal and Replacement
    Bare Board SizeSmallest:0.25*0.25 inches
    Largest:20*20 inches
    File FormateBill of Materials
    Gerber files
    Pick-N-Place file
    Types of ServiceTurn-key,partial turn-key or consignment
    Component packagingCut Tape,Tube,Reels,Loose Parts
    TestingFlying Probe Test,X-ray Inspection AOI Test
    PCB assembly processDrilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

    3. Our PCB Technical Specification

    Layer1-36 layer
    Max Board Size1100*599mm 43.3" * 24"
    Min Board Thickness4 layer 0.40mm 16mil
    6 layer 1.00mm 40mil
    8 layer 1.20mm 48mil
    10 layer 1.60mm 60mil
    Min space0.075mm 3mil
    Min line width0.075mm 3mil
    Min hole size0.1mm 4mil
    Plated wall thickness0.025mm 1mil
    Plated hole dia tolerance±0.10mm 4mil
    NO Plated hole dia tolerance±0.05mm 2mil
    Outline tolerance±0.15mm 6mil
    Twist and bent≤1.5%
    Board thickness tolerance±10%
    Copper weight0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
    Surface finishHASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
    Board materialFR-4 glass epoxy, FR4 High Tg, RoHS
    compliant; Aluminum, Rogers, etc.
    Insulation resistance1012Ω (Normal)
    Through hole resistance<300Ω(Normal)
    Electric strength>1.3KV/mm
    Current strength10A
    Peel strength1.5N/mm
    Thermal stress288℃20 Seconds
    Test voltage24-300V
    Quality 4 layer Prototype PCB Assembly Android robot PCBA HASL Surface Finish for sale
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    To: Shenzhen Yingstar Electronics Co., Ltd.
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